TY  - JOUR
Litho WorldT1  - Current Status of the Integrated Circuit Industry in China <i>― </i>Packaging and Testing Industry Review
JO  - Journal of Microelectronic Manufacturing
VL  - 2
Y1  - 2019/12/30
UR  - http://www.jommpublish.org/p/183/45/
L1  - http://www.jommpublish.org/jomm_data/publish/CB/2A/23/5BB0244C0A8654C41AC6240323/10.33079.jomm.19020409.pdf
DO  - 10.33079/jomm.19020409
ER  -